RE: What is the limit? (was RE: multi-homing fixes)

From: mike harrison [mailto:meuon@highertech.net]
Sent: Thursday, August 30, 2001 6:29 AM

Maybe it's time to make some small point cooling systems for routers.
When I was young electronics nut, we'd cool stereo amps this way
to up the power output. As the last rack mount computer I installed
had 6 cooling fans.. maybe it's time...

see "Pelletier Effect" devices. Thermos made a portable ice-box, using that
tech, for a while. It's all solid-state, no moving parts.

But with low efficiency. Plus you still have to dump the thermal
energy somewhere outside of the facility. I frankly don't see how this
approach will buy you anything.

          David Leonard
          ShaysNet

They are interesting, but what they are is merely heat pumps; you also
need to carry the heat away with the flow of some material (eventualy to
be pumped outside of the building). [Radiative cooling is not really
applicable for the required rates of heat transfer; it'd require equipent
to be hot way past the point of melting :)]

--vadim

> see "Pelletier Effect" devices. Thermos made a portable ice-box, using

that

> tech, for a while. It's all solid-state, no moving parts.
They are interesting, but what they are is merely heat pumps; you also
need to carry the heat away with the flow of some material (eventualy to
be pumped outside of the building). [Radiative cooling is not really
applicable for the required rates of heat transfer; it'd require equipent
to be hot way past the point of melting :)]

Useful for a hybrid approach though - the big problem with liquid cooling is
that the fluid and/or any condensed air vapour gets to flow inside a case
with (at least theoretically) swappable parts; difficult to arrange that
nothing requires either disconnecting and draining, or risks puncturing a
fluid carrier. By using purely solid-state components (and some sort of
thermal carrier paste) you could arrange for even hot-swappable (not an
intentional pun BTW) components to be able to pump their heat to a thermal
element on the outside of the case, which in turn is threaded with coolant
pipes for a fluid-based system to expel heat to the outside of the building.